Serener Gehäuse - Serie

Die Gehäuse der Serener - Serie kühlen die CPU der zu verbauenden Mini-ITX Mainboards über eine Heatpipe passiv. Da die Position der CPU bei den Mainboard oft unterschiedlich ist, gibt es verschiedene Heatpipes für verschiedene Mainboards. Da ein im Gehäuse verbauter lüfterloser DC-ATX Wandler und extern ein lüfterloser AC-DC Adapter zum Lieferumfang gehören und auch die Festplatten über das Gehäuse gekühlt werden, ist mit den Gehäusen der Aufbau sehr geräuscharmer PC möglich. Zu hören sind nur noch das Laufgeräusch von Festplatte und CD Laufwerk (soweit vorhanden). Wir empfehlen nach Möglichkeit den Einsatz von 2.5" Festplatten, da diese erheblich weniger Abwärme erzeugen und auch ein geringeres Laufgeräusch haben als 3.5" Festplatten.

Derzeit gibt es verschiedene Heatpipes für folgende Mainboards:
 

Heat-Pipe   Picture Name For Case For Mainboard HP1 GA-L01,GD-L01,GS-L01, GS-L02,GS-L02L VIA SP & M & PD M/B HP2 GA-L01 PWI-8552M/B HP3 GA-L01,GD-L01,GS-L02,GS-L02L COMELL LV-675 M/B HP5 GS-L05 PWI-8552M/B HP6 GA-L01,GD-L01,GS-L01, GS-L02,GS-L02L VIA SP & M & PD M/B HP7 GA-L01,GD-L01,GS-L01, GS-L02,GS-L02L VIA EN & CN M/B HP8 GN-L01 VIA NANO NL M/B HP9 GS-L05 IBASE MB879,MB890 & MB896F M/B; Cmmell LV-675 & LV-677 M/B; VIA VB6002 M/B(PN) HP10 GA-L01,GD-L01 EPOX 4MTS6B M/B HP12 GA-L01 PWI-8552M/B HP14 GS-L06 IBASE MB879,MB890,MB896F & MB899 M/B; Commell LV-675 & LV-677 M/B; VIA VB6002 M/B HP15 GS-L06 PWI-8552 M/B HP16 GA-L01,GD-L01,GS-L01, GS-L02,GS-L02L VIA VB6002 M/B HP18 GS-L05 VIA EK M/B HP19 GS-L05 JETWAY WITH C7 CPU M/B HP20 GS-L05 VIA SP & M SERIES M/B HP21 GS-L05 VIA CN M/B HP22 GS-L05 VIA EN M/B HP24 GS-L06, GS-L07 JETWAY J7F2 HP25 GS-L06,GS-L07 VIA SP & M SERIES M/B HP27 GS-L05 EX M/B HP28 GS-L06 VIA EX M/B HP29 GA-L01,GD-L01,GS-L01,GS-L02,GS-L02L. VIA EX & LT M/B HP30 GS-L08 VIA EPIA PX M/B HP32 GS-L05 IBASE MB879,MB890 & MB896F M/B;Commell LV-675 & LV-677 M/B; VIA VB6002 M/B (PN) HP35 GS-L09 VIA EPIA NX M/B HP36 GS-L05 Those M/Bs with hole-to-hole distance for heat device is 41x41mm HP37 GS-L05 VIA CN M/B VIA EN M/B HP38 GS-L05 VIA EX & LT M/B HP39 GS-L06 Those M/Bs with hole-to-hole distance for heat device is 41x41mm HP40 GS-L06 VIA CN & EN M/B HP41 GS-L06 VIA EX & LT M/B HP45 GA-L01,GD-L01,GS-L01, GS-L02,GS-L02L VIA EPIA-LN M/B HP46 GS-l05 Intel-D201GLY HP47 GS-l06 Intel-D201GLY HP49 (Basing on HP12) GA-L01 PWI-8552 M/B HP50 GA-L01 Intel D201 GLY M/B HP51 GS-L05 Jetway J7F5 HP52 GS-L02 Jetway J7F5 (Need to make modification on case structure.) In Design HP54 GS-L05 VIA EPIA-LN M/B In Design HP55 GS-L06 VIA EPIA-LN M/B

Heat-Pipe   Case-M/B-HP CASE W/ HP FORMAINBOARD GA-L01 HP1 & HP6 VIA SP & M & PD SERIES M/B HP2 & HP12 & HP49 PWI-8552 M/B HP3 Commell LV-675 M/B HP7 VIA EN & CN M/B HP10 EPOX IP-4MTS6B M/B HP16 VIA EPIA PN M/B (VIA VB6002 Board With Intel CPU) HP29 VIA EPIA-EX & LT MB HP45 VIA LN MB HP50 Intel D201GLY M/B   GD-L01 HP1 & HP6 VIA SP & M & PD SERIES M/B HP3 Commell LV-675 M/B HP7 VIA EN & CN M/B HP10 EPOX IP-4MTS6B M/B HP16 VIA EPIA PN M/B (VIA VB6002 Board With Intel CPU) HP29 VIA EPIA-EX MB HP45 VIA LN MB HP50 Intel D201GLY M/B   GN-L01 HP8 VIA Nano NL M/B   GS-L01 HP1 & HP6 VIA SP & M & PD SERIES M/B HP3 Commell LV-675 M/B HP7 VIA EN M/B HP16 VIA EPIA PN M/B (VIA VB6002 Board With Intel CPU) HP29 VIA EPIA-EX MB HP45 VIA LN MB   GS-L02 HP1 & HP6 VIA SP & M & PD SERIES M/B HP3 Commell LV-675 M/B HP7 VIA EN & CN M/B HP16 VIA EPIA PN M/B HP29 VIA EPIA EX MB HP45 VIA LN MB HP50 Intel D201GLY M/B HP52 Jetway J7F5 M/B   GS-L02L HP1 & HP6 VIA SP & M & PD SERIES M/B HP3 Commell LV-675 M/B HP7 VIA EN & CN M/B HP16 VIA EPIA PN M/B HP29 VIA EPIA EX MB HP45 VIA LN MB HP50 Intel D201GLY M/B   GS-L05 HP5 PWI-8552 M/B HP9 Commell LV-675 & LV-677 M/B VIA EPIA PN M/B (VIA VB6002 Board With Intel CPU) Ibase MB879 & MB890 & MB896F HP18 VIA EK M/B HP19 JETWAY J7F2 HP20 VIA SP & M SERIES M/B HP21 VIA CN M/B HP22 VIA EN M/B HP27 VIA EPIA EX MB HP32 Ibase MB899 M/B HP33 Commell LV-675 & LV-677 M/B VIA EPIA PN M/B (VIA VB6002 Board With Intel CPU) Ibase MB879 & MB890 & MB896F HP36 Those M/Bs with hole-to-hole distance for heat device is 41x41mm HP37 VIA CN & EN M/B HP38 VIA EX & LT M/B HP46 Intel D201GLY M/B HP51 Jetway J7F5 M/B HP54 VIA EPIA LN M/B   GS-L06 HP14 Commell LV-675 & LV-677 M/B IBase MB896F & MB899 & MB879 & MB890 M/B VIA EPIA PN M/B (VIA VB6002 Board With Intel CPU) HP15 PWI-8552 M/B HP24 JETWAY J7F2 HP25 VIA EPIA SP & M SERIES M/B HP28 VIA EPIA EX M/B HP39 Those M/Bs with hole-to-hole distance for heat device is 41x41mm HP40 VIA CN & EN M/B HP41 VIA EX & LT M/B HP47 Intel D201GLY M/B HP55 VIA EPIA LN M/B   GS-L07 HP24 JETWAY J7F2 HP25 VIA SP & M SERIES M/B   GS-L08 HP30 VIA EPIA PX M/B   GS-L09 HP35 VIA Nano-NX MB